The differences between continuous laser cleaning machines and pulsed laser cleaning machines can be summarized as follows:

1. Working Principle

• Continuous Laser Cleaning Machine
  Emits a continuous laser beam with stable power output, operating in a steady-state mode. The laser energy is delivered continuously, creating a constant heat input to the surface being cleaned.

• Pulsed Laser Cleaning Machine
  Generates discrete laser pulses (high-energy bursts) at specific frequencies. The energy is delivered in short, intermittent pulses, with periods of no energy emission between pulses.

2. Energy Output Characteristics

• Continuous Laser

• Average power is typically higher, with consistent energy distribution.

• Lower peak power compared to pulsed lasers, as energy is spread over time.

• Suitable for applications requiring sustained energy input, such as removing thick coatings, heavy rust, or large-scale contamination.

• Pulsed Laser

• Extremely high peak power in each pulse (even if average power is lower), enabling rapid energy transfer to the target.

• Short pulse durations (nanoseconds to femtoseconds) minimize heat accumulation, reducing thermal damage to the substrate.

• Ideal for delicate tasks, such as cleaning sensitive materials (e.g., electronics, polymers), precision components, or thin-layer contaminants.

3. Thermal Impact

• Continuous Laser
  Higher and more sustained heat input may cause significant thermal effects on the substrate, such as melting, oxidation, or structural changes, especially for heat-sensitive materials.

• Pulsed Laser
  Short pulse durations limit heat diffusion, resulting in a smaller heat-affected zone (HAZ). This makes it suitable for fragile or heat-sensitive materials (e.g., 文物修复 cultural relics restoration, aerospace components, or semiconductor devices).

4. Application Scenarios

• Continuous Laser Cleaning

• Industrial-scale cleaning (e.g., metal degreasing, paint stripping on large surfaces).

• Heavy-duty applications requiring high material removal rates.

• Substrates with high thermal tolerance (e.g., thick metals, concrete).

• Pulsed Laser Cleaning

• Precision cleaning (e.g., removing solder residues on PCBs, micro-contamination on optics).

• Delicate materials (e.g., wood, plastics, ancient artifacts).

• Selective cleaning where minimal substrate damage is critical (e.g., aerospace blade inspection, medical device decontamination).

5. Technical Considerations

• Continuous Laser

• Simpler optical design for continuous operation.

• Higher risk of overheating the target if not properly controlled.

• Pulsed Laser

• Requires advanced pulse control systems (e.g., Q-switching, mode-locking).

• Offers greater flexibility in adjusting pulse parameters (energy, frequency, duration) for tailored cleaning results.

In summary, the choice between the two depends on the specific cleaning requirements: continuous lasers for high-throughput, heavy-duty tasks, and pulsed lasers for precision, low-heat-impact applications.